Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company's unique Triple i-approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com and our EVG-TShop “Click, Stop – the new way to shop” www.EVGTShop.com.