Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, became independent in 1995. Palomar’s automated high-precision component assembly and precision ball and wedge bonding systems increase yield and lower costs for manufacturers in the wireless, medical, microwave, computer, automotive, aerospace and life sciences industries. Palomar Microelectronics, the assembly, test and contract manufacturing division of Palomar Technologies, Inc., offers process development and assembly services including advanced wire bonding, gold ball bumping, and direct-chip-attach of eutectic and epoxy bonded high-power LEDs, MEMS devices, microwave & RF components, optoelectronic packages, multi-chip modules, and hybrids.