Thermastrate's expertise in thermal management allows them to design and manufacture a revolutionary new generation of extremely thermally efficient, custom electronic substrate and heatsink assemblies. Products are targeted at HBLED and high power electronics applications, requiring more effective thermal and interconnect solutions than afforded by conventional materials. A unique metal-ceramic technology with Best-in-Class thermal performance allows Direct-to-Heatsink solutions, dramatically improving thermal management, optimising performance and reliability and reducing full system assembly costs. Thermastrate’s patented, ceramic insulation is a ruggedised oxide layer with excellent electrical isolation, mechanical compliance and optimised thermal conductivity. Circuits are formed on flat plate Aluminium or 3D heatsinks (extrusions, castings), which opens up new design possibilities and negates the need for attachment of an intermediate IMS board to a heatsink via Thermal Interface Materials. This saves the labour and material cost of assembly, whilst most significantly removing thermal barriers. Ceramic layer thickness is typically 35 microns, thermal conductivity over 6W/mK with an isolation voltage over 1000 Vdc between circuit and Aluminium. Flexitherm® is a new and unique, patented form of IMS, with lower thermal impedance, linked with a flexible power interconnect system. Ultratherm® consists of an electroplated Copper circuit deposited directly onto the ceramic, thereby optimizing thermal conductivity. When supplied on flat Aluminium baseplates (2mm thick) the Flexitherm® has a thermal conductivity of over 92W/mK and Ultratherm® an astounding 124W/mK which are in the region of 2 to 3 times greater than the thermal conductivity of conventional IMS materials.