BBG Micro is the leading innovator of high performance and competitively priced LED Power Packages. Our technology is based on copper heat sinks and high temperature plastics. The results are single and multi-chip packages with low thermal resistance and wide operating temperature. Low thermal resistance means that the light output is maximized. High temperature materials allow for higher power operation and reflow solderability. It also allows smaller packages for a given power rating.

Coupled with this is creative package design. Each LED chip is surrounded by a sub-cavity that has sloped walls to reflect light vertically. The sub-cavity is adjusted for each chip size. This provides the smallest and most efficient light source for high power lighting. The package designs include separate sub-cavities for a zener diode[s] that will not block the light output from the LED chips. Additionally, a unique feature has been provided to fill the cavity in two ways: from the top or from the bottom.