Foxconn Technology Pte Ltd, the thermal solutions company, are pleased to present our world class design and manufacturing capabilities to the dynamic and exciting LED industry. Part of the $43Billion Hon Hai group, our expertise and experience in thermal management has helped position us as the key OEM/ODM manufacturing partner to many of the worlds’ leading PC, networking and consumer product companies.

With over 150 D&D engineers and R&D bases in Taiwan, USA and China, our European sales and engineering support office are able to access an un-rivalled wealth of technology and innovation. A robust and focussed manufacturing & logistical support structure allows us to quickly develop customer ideas from the drawing board to product market in very short time scales.

Core competences:

1. Design and development: CFD Simulation, Mechanics (Stress) Simulation, Rapid Prototyping (3D Printing, Sheet Metal, CNC Machining), Component Level Thermal Performance Verification, System Level Thermal Performance Verification, Raw Material Analysis Capability, Reliability Testing, Environmental Verification

2. Manufacturing: Aluminum/Copper Extrusion, Metal Stamping, Plastic Molding, Die Casting, Metal Injection Molding, Chemical Etching, Surface Anodization, Chromate, Chemical Vapor Deposition, Nickel Plating, Tin Plating

3. Our company is registered to ISO 9000, 9001, 14001, OHSAS 18001 and RoHS 2002/95/EC (in-house testing capability)