TDK AFM 15 Ultrasonic gold to gold interconnect (GGI) die bonder provides “flip chip” face up LED die attach to maximize the luminescent area of packaged LEDs. GGI flip is an alternative process to gold wire bonding where perimeter gold wire bonds are replaced with array gold stud bumps to allow 50% to 70% reduction of LED package size. Ultrasonic Flip Chip GGI provides superior electrical and thermal performance using gold interconnect with high precision and the least manufacturing steps.